News > Press Release 2005
BATI and OptiWorks Announced Partnership at OFC

Anaheim, CA, March 8, 2005 - Boston Applied Technologies Incorporated (BATI) and OptiWorks today announced the partnership at the Optical Fiber Communication Conference (OFC). BATI and OptiWorks will jointly develop, manufacture, and market BATI's photonic products based on OptoCeramic® materials. With the combined advantages of strong R&D and manufacturing capabilities, BATI and OptiWorks are ready to serve the fiber-optic and telecommunication industries and to help pave the way to the broadband future with the most reliable products at the lowest cost. BATI and OptiWorks showcased their products together at the OFC for the first time.
BATI was founded in 2002 by the key management and technical team formerly with Corning Applied Technologies, a subsidiary of Corning Incorporated. BATI's proprietary OptoCeramicTM materials and devices technology platform make it unique advantageous for high performance and low cost solid-state light controlling applications ranging from fiber optic communications to optical sensors and instrumentations.

OptiWorks, a leading supplier of fiber optic components and integrated modules, was founded in 2000. It is a wholly owned subsidiary of BizLink Technology, a major supplier of electrical and optical connectivity components. OptiWorks is committed to supporting the growing demands of the fiber optic industry by engineering and manufacturing superior components and integrated modules in prototype and mass production quantities from its state-of-the-art facilities located in Fremont, CA and Shanghai, China.

 


About BATi
Boston Applied Technologies Incorporated (BATi) was formed in 2002 by the key management and technical team formerly with Corning Applied Technologies, a subsidiary of Corning Incorporated. With many years' development effort and a group of industry pioneers, BATI has established a unique leading position in designing, manufacturing and marketing a variety of light and polarization management components for the telecommunications and instrumentation markets.

 

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